FiberPlex Introduces Passive Multiplexer for Analog Optical Applications

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FiberPlex Technologies now offers a full spectrum of options for utilizing unused capacity on existing fiber optic links with the introduction of its WDP passive wavelength division multiplexers.

Annapolis Junction, Maryland – January 26, 2017 – (Newswire.com)

​​Known for its innovative approach to active wavelength division multiplexing (WDM), FiberPlex recently introduced its new line of passive multiplexers to address analog optical applications not compatible with active WDM technology. “RF, antenna, SATCOM and other optical signals that are analog in nature cannot be combined using an active wavelength division multiplexer such as our WDM16, which uses SFP modules. We introduced the WDP passive line to address those needs,” explains FiberPlex CEO Buddy Oliver.

With this, FiberPlex rounds out its multiplexer offering for recovering a large portion of the 400,000 Gigahertz fiber optic cable that would otherwise go unused, providing additional capacity over existing singlemode fiber optic lines in campuses, data centers, telecoms and broadcast facilities.

Its WDP multiplexes 8 or 16 data channels, depending on model, onto a pair of singlemode fiber by dividing them into wavelengths. Each channel is transmitted at different light waves and passively combined into a single a fiber pair. Due to its completely passive nature, the WDP models have virtually no bandwidth limitations.

By multiplexing additional channels onto an already existing fiber infrastructure, FiberPlex multiplexers effectively eliminate having to install new fiber optic cabling and all the associated labor and conduit expenses and downtime to yield the same capacity gain.

Whereas FiberPlex’s WDM active multiplexers “actively” tune to whatever wavelengths are required and use changeable SFP digital interfaces, its new WDP passive multiplexers provide fixed wavelengths unique to device or system. FiberPlex’s WDP passive and WDM active wavelength multiplexers come in 8 channel and 16 channel models.

Optical fiber communication is becoming increasingly popular due to the large bandwidth capacity, high transference rate, and security-related characteristics of fiber optics.

In addition to multiplexers, FiberPlex makes a full line of SFP modules for interfacing and converting to fiber optic communications, from serial data (EIA530, RS422, RS232, V.35) and telecom (POTS, ISDN, T1/E1, T3/E3, STS1, E&M, Avaya) to multichannel audio (MADI, Dante) and video (RS170, 3G-SDI, HDMI). FiberPlex specializes in high-demand environments, including SCIF and Tempest environments.

About FiberPlex Technologies, LLC (www.fiberplex.com)

FiberPlex Technologies, LLC is the global leader in secure digital communications. The FiberPlex brand has been engineering, manufacturing and delivering secure fiber solutions to the U.S. Government for over a quarter of a century and shares that expertise with commercial and international markets. As experts in the industry, we assist all manner of agencies, businesses, campuses, broadcasters and live production firms on how to leverage technology to solve complex communication and security problems. In addition to a complete line of off-the-shelf products, FiberPlex creates custom products for clients quickly and efficiently, making them available as “off-the-shelf” – reducing procurement headaches.

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Original Source: FiberPlex Introduces Passive Multiplexer for Analog Optical Applications

Meeting the Challenge of Diagnostics for Super-Hot Plasmas in Fusion Reactors

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It’s tough to measure the concentration of the single or neutral hydrogen atoms in fusion plasmas. The temperatures reach tens of thousands of degrees or more. A new calibration technique to improve these measurements uses different fluorescence pathways in a laser-induced fluorescence measurement system. Xenon (blue) and krypton (red) fluorescence have different optical pathways in the measurement system. The krypton fluorescence does not make it through the pinhole. Xenon does. Using xenon as the calibration gas provides a fluorescence signal that is more similar to hydrogen, improving the calibration of the system for hydrogen density measurements

The Science

In the sun and other fusion plasmas, atoms of hydrogen and its isotopes are the fuel. Plasmas are gases that are so hot that electrons are knocked free of the atom, making the atoms electrically charged ions. The un-ionized atoms are called neutrals. On earth, accurately measuring neutral hydrogen concentration in plasmas could offer insights into future fusion experiments and impact the design of a future fusion-based energy source. To measure the hydrogen density, scientists need to use a calibrated measurement method. They used krypton gas, which absorbs two chunks of light energy at the same time (photons) and in turn emits another photon. The problem is the light emitted is not at the right wavelength for accurate hydrogen density measurements. In this study, scientists discovered that xenon atoms emit light at a wavelength that calibrates well with hydrogen and improves the measurements of neutral hydrogen density.

The Impact

Knowing the concentration and location of the neutral hydrogen atoms within the super-hot plasma will help us understand and model the behavior of the plasma near the wall of the chamber. This will help in better controlling the plasma to create fusion energy in the laboratory. Discovering the two-photon sequence of events in xenon atoms significantly improves how scientists calibrate measurements of neutral hydrogen density in plasma experiments.

Summary

Controlled thermonuclear fusion is the process of fusing light elements into heavier elements to release energy for non-weapons applications. Typical elements to use as fuel are hydrogen and its isotopes, deuterium and tritium. Because the temperature in the plasmas created in these experiments ranges from tens of thousands to millions of degrees Kelvin, it is difficult to measure the location and concentration of the neutral hydrogen atoms. While scientists have obtained relative measurements of neutral density of hydrogen or its isotopes in fusion plasma experiments, hydrogen two-photon laser-induced fluorescence (TALIF) measurements calibrated with TALIF in xenon provide absolute values of density and very high spatial and temporal resolution.

Laser-induced fluorescence uses an intense laser beam focused to a tiny spot in the plasma. At the focal point of the laser, the light is so intense that atoms of hydrogen, deuterium, and tritium absorb two photons (energy packets of light) instead of the typical single photon. After the atoms absorb the two photons, they emit (fluoresce) a single photon of a different color. Measuring the emitted light tells scientists about the density of the neutral hydrogen atoms in the plasma. If scientists perform the same measurement in a known density of a gas such as krypton when the fusion experiment is turned off, they can absolutely calibrate the measurement and thereby measure the absolute density of the hydrogen isotopes inside the super-hot plasma. The calibration gas must also be able to absorb two photons at nearly the same laser wavelength as the hydrogen atoms. A major problem in performing such a measurement is that the spot from which the emission arises must be precisely located in the optics that collect the light. Historically, scientists used krypton as the calibration gas because it was the only gas known to absorb deep ultraviolet photons at nearly the same wavelength as hydrogen. However, the wavelength of light emitted by krypton is so different from that of hydrogen that the lenses in the experiment focus the krypton light to a different spot than the hydrogen light. Therefore, when researchers adjust the lenses to obtain the best krypton calibration measurements, they reduce or eliminate the hydrogen signal. This study identifies a new calibration scheme using xenon for which the wavelength of the emitted light is nearly identical to the wavelength of the hydrogen emission. With this new scheme identified, researchers can fill the fusion experiment chamber with cold xenon gas and optimize the experiment to obtain the best emission signal from xenon while simultaneously optimizing the experiment for subsequent hydrogen measurements. This discovery is a major advance in making calibrated neutral density measurements in thermonuclear fusion experiments.

Contact

Earl Scime
Oleg D. Jefimenko Professor of Physics and Astronomy, West Virginia University
earl.scime@mail.wvu.edu

Funding

This study is based on work performed at West Virginia University and the University of Washington Seattle supported through the U.S. Department of Energy, Office of Science, Experimental Program to Stimulate Competitive Research (EPSCOR) and the Office of Fusion Energy Sciences.

Publications

D. Elliott, E. Scime, and Z. Short, “Novel xenon calibration scheme for two-photon absorption laser induced fluorescence of hydrogenExternal link.” Review of Scientific Instruments 87, 11E504 (2016). [DOI: 10.1063/1.4955489]

D. Elliott, D. Sutherland, U. Siddiqui, E. Scime, C. Everson, K. Morgan, A. Hossack, B. Nelson, and T. Jarboe, “Two-photon LIF on the HIT-SI3 experiment: Absolute density and temperature measurements of deuterium neutralsExternal link.” Review of Scientific Instruments 87, 11E506 (2016). [DOI: 10.1063/1.4955494]

M. Galante, R.M. Magee, and E. Scime, “Two photon absorption laser induced fluorescence measurements of neutral density in a helicon plasmaExternal link.” Physics of Plasmas 21, 055704 (2014). [DOI: 10.1063/1.4873900]

R.M. Magee, M.E. Galante, J. Carr, Jr., G. Lusk, D.W. McCarren, and E.E. Scime, “Neutral depletion and the helicon density limitExternal link.” Physics of Plasmas 20, 123511 (2013). [DOI: 10.1063/1.4849376]

R. M. Magee, R.M., M. E. Galante, N. Gulbrandsen, and E. E. Scime, “Direct measurements of the ionization fraction in krypton helicon plasmasExternal link.” Physics of Plasmas 19, 123506 (2012). [DOI: 10.1063/1.4772060]

R.M. Magee, M.E. Galante, D. McCarren, E.E. Scime, R.L. Boivin, N.H. Brooks, R.J. Groebner, D.N. Hill, and G.D. Porter, “A two-photon absorption laser induced fluorescence diagnostic.” Review of Scientific Instruments 83, 10D701 (2012). [DOI: 10.1063/1.4728092]

Highlight Categories

Program: BES, MSE, FES

Performer/Facility: University

Zayo Group, LLC Closes $800M Senior Notes Offering

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BOULDER, Colo.–(BUSINESS WIRE)–Zayo Group, LLC (“Zayo”), a direct subsidiary of Zayo Group Holdings, Inc. (NYSE: ZAYO) and global provider of Communications Infrastructure services, announced today that it has closed its previously announced offering of $800 million aggregate principal amount of 5.750% Senior Notes due 2027 (the “2027 Senior Notes”). The offering was conducted pursuant to Rule 144A and Regulation S under the Securities Act of 1933, as amended (the “Securities Act”).

As previously announced, Zayo entered into an Incremental Amendment No. 2 (the “Amendment”) to the Amended and Restated Credit Agreement dated as of May 6, 2015 (as amended, the “Credit Agreement”). Per the terms of the Amendment, the existing $1.85 billion of term loans under the Credit Agreement were repriced at 99.75% of par, and Zayo added a new $650 million term loan tranche under the Credit Agreement at a price of 99.75% of par. The incremental $650 million tranche, together with the net proceeds of the offering of the 2027 Senior Notes, will be used to fund the consideration to be paid in connection with Zayo’s acquisition of Electric Lightwave Parent, Inc. Any excess net proceeds will be used for general corporate purposes, which may include repayment of other indebtedness, acquisitions, working capital and capital expenditures.

The 2027 Senior Notes have not been registered under the Securities Act and were offered and sold in the United States only to qualified institutional buyers in reliance on Rule 144A under the Securities Act and to certain non-U.S. persons in transactions outside the United States in reliance on Regulation S under the Securities Act.

This press release does not constitute an offer to sell or the solicitation of an offer to buy any securities nor shall there be any offer, solicitation or sale in any state or jurisdiction in which such an offer, solicitation or sale would be unlawful. This press release contains “forward-looking statements” within the meaning of the Private Securities Litigation Reform Act of 1995. These include, but are not limited to, statements regarding Zayo’s plans, intentions and expectations. Such statements are inherently subject to a variety of risks and uncertainties that could cause actual results to differ materially from those projected. These risks include, but are not limited to, market conditions and other factors that could affect Zayo’s ability to complete the proposed debt offering. A more extensive discussion of the risk factors that could impact these areas and Zayo’s overall business and financial performance can be found in Zayo’s reports and other filings filed with the Securities and Exchange Commission. Given these concerns, investors and analysts should not place undue reliance on forward-looking statements.

About Zayo Group

Zayo Group Holdings, Inc. (NYSE: ZAYO) provides communications infrastructure services, including fiber and bandwidth connectivity, colocation and cloud services to the world’s leading businesses. Customers include wireless and wireline carriers, media and content companies and finance, healthcare and other large enterprises. Zayo’s 114,500-mile network in North America and Europe includes extensive metro connectivity to thousands of buildings and data centers. In addition to high-capacity dark fiber, wavelength, Ethernet and other connectivity solutions, Zayo offers colocation and cloud services in its carrier-neutral data centers. Zayo provides clients with flexible, customized solutions and self-service through Tranzact, an innovative online platform for managing and purchasing bandwidth and services.

Semiconductor Laser Treatment Market – Industry Challenges, Key Vendors, Drivers, Trends and Forecast to 2020

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Semiconductor Laser Treatment Market report 2016-2020 provides forecast and analysis of the Semiconductor Laser Treatment industry on global and regional level. The report provides historic data with forecast from 2016 to 2020 based on volume and revenue. It includes drivers and restraints of the Semiconductor Laser Treatment market along with their impact on demand during the forecast period. The report also comprises the study of opportunities available in the market for Semiconductor Laser Treatment on the global and regional level. The Semiconductor Laser Treatment market research is a professional and in-depth study on the current state of Semiconductor Laser Treatment Industry.

Analysts forecast the Global Semiconductor Laser Treatment Market to grow at a CAGR of 11.22% during the period 2016-2020.

About Semiconductor Laser Treatment:

Medical lasers use focused light sources with precision to treat tissue. A laser light has a specific wavelength in a narrow beam, creating a high-intensity light. The use of lasers in the healthcare sector has proved to be a boon for both the semiconductor and medical industries. Lasers are used in medical treatment areas such as cosmetic dermatology for skin resurfacing, scar revision, tattoo removal, and laser hair removal; lithotripsy; ophthalmology; cancer treatment; dermatology; and general surgery for tissues.

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The report provides a basic overview of the Semiconductor Laser Treatment Market 2016-2020 including definitions, classifications, applications and market Sales chain structure. The Semiconductor Laser Treatment Market 2016-2020 report enlists several important factors, starting from the basics to advanced market intelligence which play a crucial part in strategizing.

Market driver

  • Growing awareness of use of lasers treatment in medical aesthetics
  • For a full, detailed list, view our report

Market challenge

  • Risks associated with laser-based devices
  • For a full, detailed list, view our report

Market trend

  • Shift toward non-invasive and pain-free procedures
  • For a full, detailed list, view our report

Semiconductor Laser Treatment Market report provides more drivers, challenges, trend with impact of drivers and challenges on market. Also Semiconductor Laser Treatment Market research report covers the present scenario and the growth prospects of the global Semiconductor Laser Treatment industry for 2016-2020.

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Semiconductor Laser Treatment market report provides key statistics on the market status of the Semiconductor Laser Treatment manufacturers and is a valuable source of guidance and direction for companies and individuals interested in the Semiconductor Laser Treatment industry.

The Semiconductor Laser Treatment market report gives the vendor landscape and detailed analysis of the major vendors operating in the market. The market is characterized by the presence of several established international Semiconductor Laser Treatment manufacturers who generate revenues through both direct and indirect sales. Vendor competition in the market is intense and vendors usually compete on the basis of product features, price, customized solutions, and services offered.

Key Vendors of Semiconductor Laser Treatment Market:

  • Cutera
  • Cynosure
  • Lumenis
  • Syneron Medical
  • Topcon

And many more…

Well-known Semiconductor Laser Treatment companies mainly focus on expanding their geographical reach, increasing production capacities, and upselling products by upgrading the existing ones. Also, manufacturers are solely responsible for the integration of systems, testing, and commercializing these products into the market.

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Geographical Segmentation and Analysis of the Semiconductor Laser Treatment Market:

  • Americas
  • APAC
  • Europe
  • ROW

Key questions answered in Semiconductor Laser Treatment market report:

  1. What will the market size be in 2020 and what will the growth rate be?
  2. What are the key market trends?
  3. What is driving this market?
  4. What are the challenges to market growth?
  5. Who are the key vendors in this market space?
  6. What are the market opportunities and threats faced by the key vendors?
  7. What are the strengths and weaknesses of the key vendors?

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The report gives all the answer related to Semiconductor Laser Treatment market development trends. Report having detailed analysis of upstream raw materials, downstream demand, and current market dynamics is also carried out. In the end, the report makes some important proposals for a new project of Semiconductor Laser Treatment Market 2016-2020 Industry before evaluating its feasibility. Overall, the report provides an in-depth insight of 2016-2020 global Semiconductor Laser Treatment Market covering all important parameters.

Price of Report: $2500 (Single User License)

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Detailed TOC Included in Global Semiconductor Laser Treatment Industry 2016-2020

  • Executive summary
  • Scope of the report
  • Market research methodology
  • Introduction
  • Market landscape
  • Market drivers
  • Impact of drivers
  • Market challenges
  • Impact of drivers and challenges
  • Market trends
  • Market segmentation by application
  • Geographical segmentation
  • Vendor landscape
  • Key vendor analysis

List of Exhibits in Semiconductor Laser Treatment market report:

  • Exhibit 01: Product offerings
  • Exhibit 02: Impact of drivers
  • Exhibit 03: Impact of drivers and challenges
  • Exhibit 04: Key countries in each region
  • Exhibit 05: Global Semiconductor Laser Treatment market shares by geographies 2015
  • Exhibit 06: Global Semiconductor Laser Treatment market shares by geographies 2020
  • Exhibit 07: Geographical segmentation by revenue 2015

And continued…

 

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New Report of Passive Optical LAN (POL) Market Share, Growth by Top Company, Region, Application, Driver, Trends & Forecasts by 2021

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Passive Optical LAN (POL) Market analysis is provided for global market including development trends by regions, competitive analysis of the Passive Optical LAN (POL) market. Passive Optical LAN (POL) Industry report focuses on the major drivers and restraints for the key players.

“Passive Optical LAN (POL) is a media network, this can avoid interference from external devices, improve the reliability of the network system, the fast, while saving maintenance costs. It is a new network technology. Passive Optical LAN (POL) is based on Passive Optical Network (PON) technology.

Passive Optical LAN (POL) solutions make use of a number of passive optical equipment and components. Majority of these including OLT, ONT, optical cables, optical couplers, optical power splitters, optical encoders, patch cords and pigtails, optical connectors, optical amplifiers, optical transceivers, fixed and variable optical attenuators, optical circulators, wavelength division multiplexers/de-multiplexers, and optical filters can now be found in use in FTTH applications and current data networks. Data in this report mainly refers to the sales market of Passive Optical LAN (POL) overall solution providers, like Huawei and Cisco.”

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Passive Optical LAN (POL) market analysis report speaks about the manufacturing process. The process is analysed thoroughly with respect four points Manufacturers, regional analysis, Segment by Type and Segment by Applications and the actual process of whole Passive Optical LAN (POL) industry.

Market Segment by Manufacturers, this report covers

  • Huawei
  • ZTE
  • Alcatel-Lucent
  • Zhone
  • Tellabs
  • Cisco

And many more

Market Segment by Type, covers

  • GPON
  • EPON

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Scope of the Report:

This report focuses on the Passive Optical LAN (POL) in Global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

Market Segment by Regions, regional analysis covers

  • North America (USA, Canada and Mexico)
  • Europe (Germany, France, UK, Russia and Italy)
  • Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
  • South America, Middle East and Africa

Market Segment by Applications, can be divided into

  • Education
  • Healthcare
  • Government
  • Industry

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Highlights of Global Passive Optical LAN (POL) Market Research Report:

  • To show the Passive Optical LAN (POL) market by type and application, with sales market share and growth rate by type, application
  • Passive Optical LAN (POL) market forecast, by regions, type and application, with sales and revenue, from 2016 to 2021
  • Describe Passive Optical LAN (POL) Market Introduction, product scope, market overview, market opportunities, market risk, market driving force;
  • Analyse the top manufacturers of Passive Optical LAN (POL) Industry, with sales, revenue, and price
  • Display the competitive situation among the top manufacturers, with sales, revenue and market share of Passive Optical LAN (POL) Market
  • To show the global market by regions, with sales, revenue and market share of Passive Optical LAN (POL) Industry, for each region.
  • Analyse the key regions, with sales, revenue and market share by key countries in these regions
  • Describe Passive Optical LAN (POL) Industry sales channel, distributors, traders, dealers, appendix and data source.

 

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Detailed TOC of Passive Optical LAN (POL) Market Research Report:

Chapter 1 Market Overview:

1.1 Product Overview and Scope of Passive Optical LAN (POL)

1.2 Market Analysis by Type

1.3 Market Analysis by Applications

1.4 Market Analysis by Regions

1.4.1 North America (USA, Canada and Mexico)

1.4.2 Europe (Germany, France, UK, Russia and Italy)

1.4.3 Asia-Pacific (China, Japan, Korea, India and Southeast Asia)

1.4.4 South America, Middle East and Africa

1.5 Market Dynamics

1.6 Market Opportunities

1.7 Market Risk

1.8 Market Driving Force

Chapter 2 Manufacturers Profiles:

2.1 Company Name

2.1.1 Business Overview

2.1.2 Company Name Sales, Price, Revenue, Gross Margin and Market Share

Chapter 3 Global Passive Optical LAN (POL) Market Competition, by Manufacturer:

3.1 Global Passive Optical LAN (POL) Sales and Market Share by Manufacturer

3.2 Global Passive Optical LAN (POL) Revenue and Market Share by Manufacturer

3.3 Market Concentration Rate

3.3.1 Top 3 Passive Optical LAN (POL) Manufacturer Market Share

3.3.2 Top 6 Passive Optical LAN (POL) Manufacturer Market Share

3.4 Market Competition Trend

Chapter 4 Global Passive Optical LAN (POL) Industry Analysis by Regions:

4.1 Global Passive Optical LAN (POL) Sales, Revenue and Market Share by Regions

4.2 North America Passive Optical LAN (POL) Sales and Growth (2011-2016)

4.3 Europe Passive Optical LAN (POL) Sales and Growth (2011-2016)

4.4 Asia-Pacific Passive Optical LAN (POL) Sales and Growth (2011-2016)

4.5 South America Passive Optical LAN (POL) Sales and Growth (2011-2016)

4.6 Middle East and Africa Passive Optical LAN (POL) Sales and Growth (2011-2016)

Chapter 5: North America Passive Optical LAN (POL) Sales, Revenue and Market Share by Countries (2011-2016)

Chapter 6: Europe Passive Optical LAN (POL) Sales, Revenue and Market Share by Countries (2011-2016)

Chapter 7: Asia-Pacific Passive Optical LAN (POL) Sales, Revenue and Market Share by Countries (2011-2016)

Chapter 8: South America, Middle East and Africa Passive Optical LAN (POL) Sales, Revenue and Market Share by Countries

Chapter 9: Global Passive Optical LAN (POL) Sales, Revenue and Market Share by Type (2011-2016)

Chapter 10: Global Passive Optical LAN (POL) Sales Market Share by Application (2011-2016)

Chapter 11: Passive Optical LAN (POL) Market Forecast (2016-2021)

11.1 Global Passive Optical LAN (POL) Sales, Revenue and Growth Rate (2016-2021)

11.2 Passive Optical LAN (POL) Market Forecast by Regions (2016-2021)

11.3 Passive Optical LAN (POL) Market Forecast by Type (2016-2021)

11.4 Passive Optical LAN (POL) Industry Forecast by Application (2016-2021)

Chapter 12: Sales Channel, Distributors, Traders and Dealers

12.1 Sales Channel

12.1.1 Direct Marketing

12.1.2 Indirect Marketing

12.1.3 Marketing Channel Future Trend

12.2 Distributors, Traders and Dealers

 

No. of Report pages: 114

Price of Report: $ 3480 (Single User Licence)

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Silicon Photonics Market Growth and Forecast 2015-2025

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In silicon photonics technology, silicon is used as a platform for the photonic circuits to create optical communication system which is highly integrated. The modern trend of miniaturization of electronic devices with increasing requirement for speed and efficiency as well as keeping the cost economical, has led to the increase in demand for the global silicon photonics market. This has led to the silicon photonics market becoming an interesting avenue globally as it has the advantage of requiring low power consumption, having higher density of interconnects, higher integration and reliability. The global silicon photonics market is anticipated to grow with two digit compound annual growth rate.

Silicon Photonics Market: Drivers & Restraints

The largest market for global silicon photonics market is data communication, as the protocol is providing services which is surpassing optical and copper technologies. The government providing financial support and the growing demand for the transference of data is driving the growth of global silicon photonics market. Demand for global silicon photonics market is also driven by covering distance or data rates which have not been provided by vertical cavity surface-emitting lasers (VCSELs), providing faster data rates while maintaining low cost. Various constraints for the global silicon photonics market are high cost as the companies have to develop the Computer-aided engineering/Computer-aided design (CAE/CAD) on their own and competition with VCSEL which is available at a low cost.

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Silicon Photonics Market: Segmentation

On the basis of application, global silicon photonics market can be segmented into:

  • Telecommunications
  • Datacom
  • High Performance Computer (HPC) and data centers
  • Medical
  • Sensing and instruments
  • Defense/aerospace industries
  • Research and development
  • Others (consumers-connecting PCs with HDTVs and desktop PC devices, commercial video, etc.)

On the basis of products, global silicon photonics market can be segmented into:

  • Silicon optical modulators
  • Wavelength division multiplexer filters
  • Silicon photo-detectors
  • Silicon photonic waveguides
  • Others (silicon led, silicon optical interconnects, etc.)

Silicon Photonics Market: Region-wise Outlook

In terms of region, North America has the highest market for silicon optical modulators and wavelength division multiplexer filters. North America is becoming an attractive destination for the companies to launch the silicon photonics market due to government support and increase in demand for the data transfer but Asia-Pacific has the highest CAGR for global silicon photonics market due to rising population, increase in urbanization and growing demand for data transfer.

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Silicon Photonics Market: Key Players

Some of the identified key players in the global silicon photonics market are Infinera, NeoPhotonics, Avago technologies, Luxtera, Mellanox technologies, OneChip Photonics, Cisco, Skorpios technologies, Photline technologies, etc.

The research report presents a comprehensive assessment of the market and contains thoughtful insights, facts, historical data, and statistically supported and industry-validated market data. It also contains projections using a suitable set of assumptions and methodologies. The research report provides analysis and information according to market segments such as geographies, types and applications.

Facet Technology Launches Its Safe and Secure LiDAR™ Crosstalk Elimination Licensing Program

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Minneapolis, MN, January 27, 2017 –(PR.com)– Facet Technology is now offering technology licenses to LiDAR suppliers for the elimination of crosstalk. The patent-pending technology utilizes a multi-bit temporal encoding technique to create unique digital signatures. These signatures ensure that LiDAR units only process their own reflected signals as valid data.

The industry is beginning to understand the looming crisis that the mass deployment of LiDAR devices will create. When two or more LiDAR devices operating at the same wavelength are illuminating a common field of view there are times when they sense emitted, reflected or scattered data from other like-wavelength sources. These unwanted signals create the appearance of false objects that are closer to the vehicle than the actual objects. This can cause vehicles with automated braking systems to inappropriately slow, halt or take other evasive maneuvers. OEMs are concerned about safety issues, potential recalls and negative impact on their brand. Current techniques such as analog accumulation, digital averaging and software filters that are being developed only reduce the frequency of the problem. Facet’s technology can eliminate the problem.

Industry expert Phil Magney, Founder & Principal Advisor at Vision Systems Intelligence, says “There is a growing awareness in the industry of the LiDAR crosstalk problem. Suppliers are trying to determine the safest and most cost-effective means to manage this issue. Quanergy has announced that they are taking a leading position in solving this problem by leveraging a multi-bit encoding technique for their 2017 solid state product.”

John Dolejsi, CEO of Facet Technology, says “Facet is working with several Tier 1, Tier 2 and LiDAR suppliers to engineer their next generation products to be crosstalk safe and secure. Our company’s mission is to help make vehicle automation safe and affordable for all stakeholders in the industry. Suppliers are starting to solidify their hardware designs for the mass-production of automated braking systems. We feel that this technology is too important to the success of the industry to limit its availability to a handful of select devices. We are racing against the clock to implement the safe hardware modifications for all automated braking systems.”

Technology licenses are available for all types of suppliers.

About LiDAR Crosstalk and Interference
LiDAR crosstalk occurs when a signal of a device’s target wavelength is received at a device detector prior to the reflected signal of the device’s own emitter. Since LiDAR for ground vehicles operates at short ranges (20-200 meters) and since emitted pulses travel at the speed of light, a common misconception is that the chances of crosstalk occurring are miniscule. Statistics show that two LiDAR units with overlapping fields of view can experience crosstalk at a rate of over 2%.

Crosstalk will appear as a detected object that is closer to the device than the actual sensed object. For LiDAR units that are used for automated braking systems, this closer object, referred to as a false positive, will render the automated braking system ineffective since the crosstalk signal will need to be operated upon by the braking unit or the vehicle control system.

Crosstalk has been an issue for temporal LiDAR units for many years. Early providers of mobile mapping equipment, like Facet Technology, wrestled with crosstalk when they installed multiple devices on a single vehicle. All spatial zones where fields of view overlapped for multiple temporal devices would exhibit crosstalk. Scanning devices would attempt to mitigate crosstalk by minimizing the aperture on each LiDAR detector and synchronizing when multiple units emitted light pulses.

With the advent of flash LiDAR and non-scanning solid state LiDAR the trend has been to increase the aperture of the detectors. While performance is increased and cost is reduced, the likelihood of crosstalk events is increased. Furthermore, an increase in the number of LiDAR units all broadcasting the same wavelength will create an interference catastrophe for these low-cost units. The increasing rate of false positives for automated braking systems will force suppliers to add layers of software intelligence in an effort to distinguish between false positives and actual required braking events. Many believe as large numbers of LiDAR devices are deployed crosstalking temporal LiDAR units will need to be retrofitted with non-crosstalk devices due to safety issues.

Facet Technology Corp. developed technology and intellectual property to eliminate crosstalk in temporal LiDAR devices. The patent-pending technique utilizes multi-bit encoded pulse streams to allow LiDAR units to differentiate self-generated detected waveforms from stray signals caused by emitted or reflected waveforms from other like-wavelength devices.

About Facet Technology Corp.
Facet Technology was founded in 1999 and is a machine vision company with a strong history of innovation. Facet serves customers with vision sensor technology, HD mapping technology and government DOTs with asset and road attribute management. Facet customers are located throughout North America where Facet has driven over 1,800,000 miles of roadways capturing LiDAR and image data. Facet has developed automation and analysis software tools to process the road features from the collected data. From this experience, Facet has created patented innovations in vision sensors, mapping, data analysis and automation. Facet inventors have been awarded over 30 US Patents and Facet has sold or licensed patents to Google, Intellectual Ventures, TomTom, 3M and others.

Facet Technology contact
John Dolejsi
dolejsi@facet-tech.com
Phone: (952) 944-1839
www.facet-tech.com

About Vision Systems Intelligence, LLC
VSI has built a unique intelligence tool for the examination of vehicle perception and control systems. Called the Vision Systems Profiler, this database allows designers of automotive solutions a tool for locating, understanding, and qualifying suppliers of perception and control systems IP. The database includes all functional elements of autonomous control including processors, ECUs, domain controllers, sensors, test/validation tools, and more.

Vision Systems Intelligence contact
Phil Magney
phil@visionsystemsintelligence.com

Contact Information:
Facet Technology Corporation
John Dolejsi
952-944-1839
Contact via Email
facet-tech.com

Read the full story here: http://www.pr.com/press-release/703312

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HPQ Silicon Achieves Significant Scaling Milestones; 9,000 % Increase in Bench Test sample size; 300 % Increase in Capacity of Lab Scale PUREVAP(tm) Reactor

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Tickers: XTSX:HPQ
Tags: Mining

January 26, 2017 / TheNewswire / Montreal, Quebec, Canada – HPQ Silicon Resources Inc (“HPQ”) (TSX Venture: HPQ) is pleased to inform its shareholders that PyroGenesis Canada Inc (“PyroGenesis”) has submitted a new stage report entitled “Update on The PUREVAP Process Characterization Testing Phase” pertaining to 36 of 50 tests completed to date. The findings are significant in that they demonstrate the success of bench scale test work in scaling up the process of converting low purity feedstock into higher purity silicon metal.

Bernard Tourillon, Chairman and CEO of HPQ-Silicon stated, “Demonstrating the scalability, at lab scale, of the PUREVAPtm QRR process in a repeatable and predictable manner while obtaining consistent purity results of 99.9+% (3N+)1 Si using 98.14% or less (1N) SiO2 feedstock, represents yet another important technical milestones in in our progress toward production of High Purity Silicon metal. At this stage of our development, we have passed the critical milestones of consistently increasing sample size and now work will focus on improving the purity of the final product. This ‘iterative’ approach of incrementally increasing size, and purity step by step will continue and has so far been highly successful”.

TESTING CONFIRMS LAB SCALE SCALABILITY OF PUREVAP(TM) QRR PROCESS

The report confirms the scalability of the Process, explaining that in order to improve the yield of High Purity Silicon Metal (99.9+% Si) produced per batch, the lab-scale PUREVAPtm QRR reactor was successfully modified and capacity scaled up by a factor of 3 (300%). As a result, yield went from less than 0.1 g to 8.8 g (test #32), an increase of approximately 9,000% (hundredfold).

Of significant interest is the fact that all these results were obtained using lower purity feedstock (98.14% or less SiO2) than used by the Silicon Metal industry to produce Metallurgical Grade Silicon Metal (98.5% Si). Moreover, the results suggest that HPQ PUREVAP(TM) QRR PROCESS is the only process in the world that can systematically produce Silicon Metal of a purity above 3N+ (99.9+% Si) from sub-standard purity feed quartz.

“We are extremely pleased with the progress to date,” said Pierre Carabin, CTO of PyroGenesis. “Our ability to increase capacity by a factor of nearly hundredfold in such a short time gives us great confidence in scaling up the process to the 200 TPY pilot phase”.

INCREASING PURITY TO SOLAR GRADE SI (5N+) NOW BECOMES KEY FOCUS IN FINAL 14 TESTS

During the Proof of Concept phase, only high-purity quartz (99.97% SiO2) was used, while low-purity quartz (maximum 98.4%) was used for the other 36 tests. Moving forward, some tests will be conducted using higher purity feed stock (99.5% SiO2) in order to study the effect of reducing impurity at the source.

Test 19 confirmed that by adding a solid purifying agent into the feedstock, the production of 4N+ purity Silicon Metal (99.99+% Si)2 using 98.14% SiO2 was reachable. The engineering team at Pyrogenesis will continue to evaluate results and make process modifications to the PUREVAP(TM) QRR therefore allowing us to find the optimal purification process.

“Producing Solar Grade Silicon Metal remains our primary objective. For the remaining 14 tests, our intention is to focus solely on improving purity, with a goal of producing minimum 5N Si material,” said Tourillon. “In addition, PyroGenesis will also test an alternative route to higher purity during the ongoing test work.”

The R&D lab testing is still ongoing and the project is on schedule for end of February 2017 completion. By the end of the Process Characterization phase, PyroGenesis expects to have conducted 50 laboratory scale experiments. The data collected during the Process Characterization phase is being used for the Pilot Scale design, which is also currently underway.

VISUALIZING RAMP UP YIELD – RESULTS FROM TEST #24 – 32

Figure 1 – Small bead produced during test #24


Click Image To View Full Size

Figure 2 – Series of chunks produced during test #32

Pierre Carabin, Eng., M. Eng., has reviewed and approved the technical content of this press release.

About HPQ Silicon

HPQ Silicon Resources Inc is a TSX-V listed junior exploration company planning to become a vertically integrated and diversified High Value Silicon Metal (99.9+% Si), and Solar Grade Silicon Metal (99.999+% Si) producer.

Our business model is focused on developing a disruptive High Purity and Solar Grade Silicon Metal manufacturing process (patent pending) and becoming a vertically – integrated High Value Silicon Metal and Solar Grade Silicon producer that can generate high yield returns and significant free cash flow within a relatively short time line.

Disclaimers:

This press release contains certain forward-looking statements, including, without limitation, statements containing the words “may”, “plan”, “will”, “estimate”, “continue”, “anticipate”, “intend”, “expect”, “in the process” and other similar expressions which constitute “forward-looking information” within the meaning of applicable securities laws. Forward-looking statements reflect the Company’s current expectation and assumptions, and are subject to a number of risks and uncertainties that could cause actual results to differ materially from those anticipated. These forward-looking statements involve risks and uncertainties including, but not limited to, our expectations regarding the acceptance of our products by the market, our strategy to develop new products and enhance the capabilities of existing products, our strategy with respect to research and development, the impact of competitive products and pricing, new product development, and uncertainties related to the regulatory approval process. Such statements reflect the current views of the Company with respect to future events and are subject to certain risks and uncertainties and other risks detailed from time-to-time in the Company’s on-going filings with the securities regulatory authorities, which filings can be found at www.sedar.com. Actual results, events, and performance may differ materially. Readers are cautioned not to place undue reliance on these forward-looking statements. The Company undertakes no obligation to publicly update or revise any forward-looking statements either as a result of new information, future events or otherwise, except as required by applicable securities laws.

Neither the TSX Venture Exchange nor its Regulation Services Provider (as that term is defined in the policies of the TSX Venture Exchange) accepts responsibility for the adequacy or accuracy of this release.

For further information contact

Bernard J. Tourillon, Chairman and CEO Tel (514) 907-1011
Patrick Levasseur, President and COO Tel: (514) 262-9239

www.HPQSilicon.com

1 Analyses completed at the << Centre de Caracterisation Microscopique des Materiaux >> (CM2), located at the Ecole Polytechnique de
Montreal using a Scanning Electron Microscope (SEM) associated with a Wavelength-Dispersive Spectroscopy (WDS)

2
Please refer to HPQ -Silicon Resources Inc November 29, 2016 press releases

Copyright (c) 2017 TheNewswire – All rights reserved.

HPQ Silicon Achieves Significant Scaling Milestones; 9,000 % Increase in Bench Test sample size; 300 % Increase in Capacity of Lab Scale PUREVAP(tm) Reactor

Submit the press release

Tickers: XTSX:HPQ
Tags: Mining

January 26, 2017 / TheNewswire / Montreal, Quebec, Canada – HPQ Silicon Resources Inc (“HPQ”) (TSX Venture: HPQ) is pleased to inform its shareholders that PyroGenesis Canada Inc (“PyroGenesis”) has submitted a new stage report entitled “Update on The PUREVAP Process Characterization Testing Phase” pertaining to 36 of 50 tests completed to date. The findings are significant in that they demonstrate the success of bench scale test work in scaling up the process of converting low purity feedstock into higher purity silicon metal.

Bernard Tourillon, Chairman and CEO of HPQ-Silicon stated, “Demonstrating the scalability, at lab scale, of the PUREVAPtm QRR process in a repeatable and predictable manner while obtaining consistent purity results of 99.9+% (3N+)1 Si using 98.14% or less (1N) SiO2 feedstock, represents yet another important technical milestones in in our progress toward production of High Purity Silicon metal. At this stage of our development, we have passed the critical milestones of consistently increasing sample size and now work will focus on improving the purity of the final product. This ‘iterative’ approach of incrementally increasing size, and purity step by step will continue and has so far been highly successful”.

TESTING CONFIRMS LAB SCALE SCALABILITY OF PUREVAP(TM) QRR PROCESS

The report confirms the scalability of the Process, explaining that in order to improve the yield of High Purity Silicon Metal (99.9+% Si) produced per batch, the lab-scale PUREVAPtm QRR reactor was successfully modified and capacity scaled up by a factor of 3 (300%). As a result, yield went from less than 0.1 g to 8.8 g (test #32), an increase of approximately 9,000% (hundredfold).

Of significant interest is the fact that all these results were obtained using lower purity feedstock (98.14% or less SiO2) than used by the Silicon Metal industry to produce Metallurgical Grade Silicon Metal (98.5% Si). Moreover, the results suggest that HPQ PUREVAP(TM) QRR PROCESS is the only process in the world that can systematically produce Silicon Metal of a purity above 3N+ (99.9+% Si) from sub-standard purity feed quartz.

“We are extremely pleased with the progress to date,” said Pierre Carabin, CTO of PyroGenesis. “Our ability to increase capacity by a factor of nearly hundredfold in such a short time gives us great confidence in scaling up the process to the 200 TPY pilot phase”.

INCREASING PURITY TO SOLAR GRADE SI (5N+) NOW BECOMES KEY FOCUS IN FINAL 14 TESTS

During the Proof of Concept phase, only high-purity quartz (99.97% SiO2) was used, while low-purity quartz (maximum 98.4%) was used for the other 36 tests. Moving forward, some tests will be conducted using higher purity feed stock (99.5% SiO2) in order to study the effect of reducing impurity at the source.

Test 19 confirmed that by adding a solid purifying agent into the feedstock, the production of 4N+ purity Silicon Metal (99.99+% Si)2 using 98.14% SiO2 was reachable. The engineering team at Pyrogenesis will continue to evaluate results and make process modifications to the PUREVAP(TM) QRR therefore allowing us to find the optimal purification process.

“Producing Solar Grade Silicon Metal remains our primary objective. For the remaining 14 tests, our intention is to focus solely on improving purity, with a goal of producing minimum 5N Si material,” said Tourillon. “In addition, PyroGenesis will also test an alternative route to higher purity during the ongoing test work.”

The R&D lab testing is still ongoing and the project is on schedule for end of February 2017 completion. By the end of the Process Characterization phase, PyroGenesis expects to have conducted 50 laboratory scale experiments. The data collected during the Process Characterization phase is being used for the Pilot Scale design, which is also currently underway.

VISUALIZING RAMP UP YIELD – RESULTS FROM TEST #24 – 32

Figure 1 – Small bead produced during test #24


Click Image To View Full Size

Figure 2 – Series of chunks produced during test #32

Pierre Carabin, Eng., M. Eng., has reviewed and approved the technical content of this press release.

About HPQ Silicon

HPQ Silicon Resources Inc is a TSX-V listed junior exploration company planning to become a vertically integrated and diversified High Value Silicon Metal (99.9+% Si), and Solar Grade Silicon Metal (99.999+% Si) producer.

Our business model is focused on developing a disruptive High Purity and Solar Grade Silicon Metal manufacturing process (patent pending) and becoming a vertically – integrated High Value Silicon Metal and Solar Grade Silicon producer that can generate high yield returns and significant free cash flow within a relatively short time line.

Disclaimers:

This press release contains certain forward-looking statements, including, without limitation, statements containing the words “may”, “plan”, “will”, “estimate”, “continue”, “anticipate”, “intend”, “expect”, “in the process” and other similar expressions which constitute “forward-looking information” within the meaning of applicable securities laws. Forward-looking statements reflect the Company’s current expectation and assumptions, and are subject to a number of risks and uncertainties that could cause actual results to differ materially from those anticipated. These forward-looking statements involve risks and uncertainties including, but not limited to, our expectations regarding the acceptance of our products by the market, our strategy to develop new products and enhance the capabilities of existing products, our strategy with respect to research and development, the impact of competitive products and pricing, new product development, and uncertainties related to the regulatory approval process. Such statements reflect the current views of the Company with respect to future events and are subject to certain risks and uncertainties and other risks detailed from time-to-time in the Company’s on-going filings with the securities regulatory authorities, which filings can be found at www.sedar.com. Actual results, events, and performance may differ materially. Readers are cautioned not to place undue reliance on these forward-looking statements. The Company undertakes no obligation to publicly update or revise any forward-looking statements either as a result of new information, future events or otherwise, except as required by applicable securities laws.

Neither the TSX Venture Exchange nor its Regulation Services Provider (as that term is defined in the policies of the TSX Venture Exchange) accepts responsibility for the adequacy or accuracy of this release.

For further information contact

Bernard J. Tourillon, Chairman and CEO Tel (514) 907-1011
Patrick Levasseur, President and COO Tel: (514) 262-9239

www.HPQSilicon.com

1 Analyses completed at the << Centre de Caracterisation Microscopique des Materiaux >> (CM2), located at the Ecole Polytechnique de
Montreal using a Scanning Electron Microscope (SEM) associated with a Wavelength-Dispersive Spectroscopy (WDS)

2
Please refer to HPQ -Silicon Resources Inc November 29, 2016 press releases

Copyright (c) 2017 TheNewswire – All rights reserved.

FiberPlex Introduces Passive Multiplexer for Analog Optical Applications

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FiberPlex Technologies now offers a full spectrum of options for utilizing unused capacity on existing fiber optic links with the introduction of its WDP passive wavelength division multiplexers.

​​Known for its innovative approach to active wavelength division multiplexing (WDM), FiberPlex recently introduced its new line of passive multiplexers to address analog optical applications not compatible with active WDM technology. “RF, antenna, SATCOM and other optical signals that are analog in nature cannot be combined using an active wavelength division multiplexer such as our WDM16, which uses SFP modules. We introduced the WDP passive line to address those needs,” explains FiberPlex CEO Buddy Oliver.

With this, FiberPlex rounds out its multiplexer offering for recovering a large portion of the 400,000 Gigahertz fiber optic cable that would otherwise go unused, providing additional capacity over existing singlemode fiber optic lines in campuses, data centers, telecoms and broadcast facilities.

RF, antenna, SATCOM and other optical signals that are analog in nature cannot be combined using an active wavelength division multiplexer…We introduced the WDP passive line to address those needs.

Buddy Oliver, CEO, FiberPlex Technologies

Its WDP multiplexes 8 or 16 data channels, depending on model, onto a pair of singlemode fiber by dividing them into wavelengths. Each channel is transmitted at different light waves and passively combined into a single a fiber pair. Due to its completely passive nature, the WDP models have virtually no bandwidth limitations.

By multiplexing additional channels onto an already existing fiber infrastructure, FiberPlex multiplexers effectively eliminate having to install new fiber optic cabling and all the associated labor and conduit expenses and downtime to yield the same capacity gain.

Whereas FiberPlex’s WDM active multiplexers “actively” tune to whatever wavelengths are required and use changeable SFP digital interfaces, its new WDP passive multiplexers provide fixed wavelengths unique to device or system. FiberPlex’s WDP passive and WDM active wavelength multiplexers come in 8 channel and 16 channel models.

Optical fiber communication is becoming increasingly popular due to the large bandwidth capacity, high transference rate, and security-related characteristics of fiber optics.

In addition to multiplexers, FiberPlex makes a full line of SFP modules for interfacing and converting to fiber optic communications, from serial data (EIA530, RS422, RS232, V.35) and telecom (POTS, ISDN, T1/E1, T3/E3, STS1, E&M, Avaya) to multichannel audio (MADI, Dante) and video (RS170, 3G-SDI, HDMI). FiberPlex specializes in high-demand environments, including SCIF and Tempest environments.

About FiberPlex Technologies, LLC (www.fiberplex.com)

FiberPlex Technologies, LLC is the global leader in secure digital communications. The FiberPlex brand has been engineering, manufacturing and delivering secure fiber solutions to the U.S. Government for over a quarter of a century and shares that expertise with commercial and international markets. As experts in the industry, we assist all manner of agencies, businesses, campuses, broadcasters and live production firms on how to leverage technology to solve complex communication and security problems. In addition to a complete line of off-the-shelf products, FiberPlex creates custom products for clients quickly and efficiently, making them available as “off-the-shelf” – reducing procurement headaches.

Source: FiberPlex Technologies, LLC